"Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical ..."

Mariappan Murugesan et al. (2014)

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DOI: 10.1109/3DIC.2014.7152158

access: closed

type: Conference or Workshop Paper

metadata version: 2019-12-27

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Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka:
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC 2014: 1-4

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