"Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV."

Mariappan Murugesan et al. (2013)

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DOI: 10.1109/3DIC.2013.6702364

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Mariappan Murugesan, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Yuji Sutou, H. Wang, J. Koike:
Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV. 3DIC 2013: 1-4

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