"Mitigating thermo mechanical stress in high-density 3D-LSI through ..."

Mariappan Murugesan et al. (2015)

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DOI: 10.1109/3DIC.2015.7334579

access: closed

type: Conference or Workshop Paper

metadata version: 2022-02-18

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Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka:
Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. 3DIC 2015: TS8.10.1-TS8.10.5

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