"Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce ..."

Takuji Miki et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058860

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Takuji Miki, Makoto Nagata, Akihiro Tsukioka, Noriyuki Miura, Takaaki Okidono, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi:
Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs. 3DIC 2019: 1-4

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