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"Impact of containment and deposition method on sub-micron chip-to-wafer ..."
Sebastien Mermoz et al. (2011)
- Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny:
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. 3DIC 2011: 1-5
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