"Front-side mid-level Tungsten TSV integration for high-density 3D ..."

Brian Mattis et al. (2016)

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DOI: 10.1109/3DIC.2016.7970008

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-13

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Brian Mattis, Lovelace Soirez, Catherine Bullock, Dave Martini, Sara Jensen, James Levy, Adam Jones:
Front-side mid-level Tungsten TSV integration for high-density 3D applications. 3DIC 2016: 1-4

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