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"Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films ..."

Taro Matsudaira et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058791

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-05

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Taro Matsudaira, Shunsuke Shindo, Tomohiro Shimizu, Takeshi Ito, Shoso Shinguhara, Satoru Shimizu:
Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application. 3DIC 2019: 1-4

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