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"Variation of thermal stress in TSV structures caused by crystallinity of ..."
Jiatong Liu, Ken Suzuki, Hideo Miura (2015)
- Jiatong Liu, Ken Suzuki, Hideo Miura:
Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections. 3DIC 2015: TS8.5.1-TS8.5.5
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