"Cost-Effective Low-Temperature Hybrid Bonding Using Layer Transfer Technology."

Yu-Lun Liu et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830168

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Yu-Lun Liu, Chun-Ta Li, Tzu-Han Sun, Chien-Kang Hsiung, Yuan-Chiu Huang, Kuan-Neng Chen:
Cost-Effective Low-Temperature Hybrid Bonding Using Layer Transfer Technology. 3DIC 2024: 1-4

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