"Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs."

Xiongfei Liao, Jun Zhou, Xin Liu (2011)

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DOI: 10.1109/3DIC.2012.6263036

access: closed

type: Conference or Workshop Paper

metadata version: 2020-05-13

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Xiongfei Liao, Jun Zhou, Xin Liu:
Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs. 3DIC 2011: 1-4

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