"Impact of 3-D integration process on memory retention characteristics in ..."

Kang Wook Lee et al. (2013)

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DOI: 10.1109/3DIC.2013.6702336

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory. 3DIC 2013: 1-4

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