"Effects of electro-less Ni layer as barrier/seed layers for high reliable ..."

K. W. Lee et al. (2014)

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DOI: 10.1109/3DIC.2014.7152153

access: closed

type: Conference or Workshop Paper

metadata version: 2019-12-27

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K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi:
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC 2014: 1-4

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