"Permanent wafer bonding in the low temperature by using various plasma ..."

Soon-Wook Kim et al. (2015)

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DOI: 10.1109/3DIC.2015.7334576

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne, Chung-Sun Lee:
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. 3DIC 2015: TS7.2.1-TS7.2.4

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