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"Fabrication and bonding process of fine pitch Cu pillar bump on thin Si ..."
Won-Myoung Ki et al. (2011)
- Won-Myoung Ki, Myong-Suk Kang, Sehoon Yoo, Chang-Woo Lee:
Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC. 3DIC 2011: 1-4
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