"Fast filling of through-silicon via (TSV) with conductive polymer/metal ..."

Jin Kawakita, Barbara Horváth, Toyohiro Chikyow (2015)

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DOI: 10.1109/3DIC.2015.7334583

access: closed

type: Conference or Workshop Paper

metadata version: 2017-09-16

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Jin Kawakita, Barbara Horváth, Toyohiro Chikyow:
Fast filling of through-silicon via (TSV) with conductive polymer/metal composites. 3DIC 2015: TS8.14.1-TS8.14.5

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