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"Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding ..."
Liangxing Hu et al. (2021)
- Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan:
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. 3DIC 2021: 1-5
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