"Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed ..."

Masahide Goto et al. (2019)

> Home

Details and statistics

DOI: 10.1109/3DIC48104.2019.9058785

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/GotoVWHNIHHSKTH19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/GotoVWHNIHHSKTH19
Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers. 3DIC 2019: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.