"Low temperature direct wafer to wafer bonding for 3D integration: Direct ..."

Gweltaz Gaudin et al. (2010)

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DOI: 10.1109/3DIC.2010.5751472

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon:
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. 3DIC 2010: 1-4

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