"Temporary bonding strength control for self-assembly-based 3D integration."

Takafumi Fukushima et al. (2011)

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DOI: 10.1109/3DIC.2012.6262954

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi:
Temporary bonding strength control for self-assembly-based 3D integration. 3DIC 2011: 1-4

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