"Copper micro and nano particles mixture for 3D interconnections application."

Yuan Yuan Dai et al. (2015)

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DOI: 10.1109/3DIC.2015.7334614

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Yuan Yuan Dai, Mei Zhen Ng, P. Anantha, Chee Lip Gan, Chuan Seng Tan:
Copper micro and nano particles mixture for 3D interconnections application. 3DIC 2015: TS8.9.1-TS8.9.5

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