"Numerical and experimental study on Cu protrusion of Cu-filled ..."

Fa Xing Che et al. (2011)

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DOI: 10.1109/3DIC.2012.6262985

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Fa Xing Che, Wahyuaji Narottama Putra, A. Heryanto, A. Trigg, S. Gao, Chee Lip Gan:
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). 3DIC 2011: 1-6

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