"High density backside tungsten TSV for 3D stacked ICs."

Reynard Blasa et al. (2016)

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DOI: 10.1109/3DIC.2016.7970020

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-13

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Reynard Blasa, Brian Mattis, Dave Martini, Sidi Lanee, Carl Petteway, Sangki Hong, Kangsoo Yi:
High density backside tungsten TSV for 3D stacked ICs. 3DIC 2016: 1-4

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