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Jian (Jessie) Wu

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2008
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Jian (Jessie) Wu, Xuekun Sun, Z. J. Pei, X. Jack Xin, Kelli Simmelink:
Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments. Int. J. Manuf. Technol. Manag. 13(2/3/4): 169-186 (2008)

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