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J. K. Shang

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Journal Articles

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2013
[j2]
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  - https://dblp.org/rec/journals/mr/ShangZLTS13
P. J. Shang, L. Zhang, Zhi-Quan Liu, J. Tan, J. K. Shang:
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process. Microelectron. Reliab. 53(6): 899-905 (2013)
2011
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X. Y. Pang, Zhi-Quan Liu, S. Q. Wang, J. K. Shang:
Effects of Bi segregation on the tensile properties of Cu/Cu₃Sn(1 0 0) interface. Microelectron. Reliab. 51(12): 2330-2335 (2011)

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