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Luke England

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2010 – 2019

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2019
[c4]
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  dblp key:
  - conf/mwscas/ChaudhuriKEG19
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  - https://dblp.org/rec/conf/mwscas/ChaudhuriKEG19
Arjun Chaudhuri, Sukeshwar Kannan, Luke England, Jack Golz:
Compact Scalable Dynamic TSV IR Drop Compensation for Power Delivery in 3D Packages. MWSCAS 2019: 1179-1182
2017
[c3]
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  - conf/iscas/SadiKET17
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Mehdi Sadi, Sukeshwar Kannan, Luke England, Mark M. Tehranipoor:
Design of a digital IP for 3D-IC die-to-die clock synchronization. ISCAS 2017: 1-4
2016
[c2]
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  - conf/3dic/EnglandKAS16
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Luke England, Sukeshwar Kannan, Rahul Agarwal, Daniel Smith:
Impact of TSV integration on 14nm FinFET device performance. 3DIC 2016: 1-5
[c1]
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  - conf/iccad/KannanSE16
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Sukeshwar Kannan, Mehdi Sadi, Luke England:
Power delivery in 3D packages: current crowding effects, dynamic IR drop and compensation network using sensors (invited paper). ICCAD 2016: 55
2011
[j1]
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  - journals/mr/EnglandELL11
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Luke England, Siew Tze Eng, Chris Liew, Hock Heng Lim:
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes. Microelectron. Reliab. 51(1): 81-87 (2011)

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