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K.-Y. Byun

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2010 – 2019

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2013
[c1]
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  dblp key:
  - conf/3dic/FukushimaBMSSBKLK13
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  - https://dblp.org/rec/conf/3dic/FukushimaBMSSBKLK13
Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Ho-Young Son, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi:
3D memory chip stacking by multi-layer self-assembly technology. 3DIC 2013: 1-4
2012
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Arief Suriadi Budiman, H.-A.-S. Shin, B.-J. Kim, S.-H. Hwang, Ho-Young Son, Min-Suk Suh, Q.-H. Chung, K.-Y. Byun, Nobumichi Tamura, Martin Kunz, Young-Chang Joo:
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits. Microelectron. Reliab. 52(3): 530-533 (2012)

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