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Kyung-Wook Paik

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2020 – today

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2022
[j10]
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  - journals/sensors/LeeJLPPPL22
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  - https://dblp.org/rec/journals/sensors/LeeJLPPPL22
Taemin Lee, Joontaek Jung, Sang-Mok Lee, Jongcheol Park, Jae-Hyeong Park, Kyung-Wook Paik, Hyunjoo J. Lee:
FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays. Sensors 22(15): 5557 (2022)

2010 – 2019

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2017
[j9]
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  - journals/mr/ZhangLHP17
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Shuye Zhang, Tiesong Lin, Peng He, Kyung-Wook Paik:
Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly. Microelectron. Reliab. 78: 181-189 (2017)
2015
[j8]
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  - journals/mr/ShinKCKKJP15
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Jiwon Shin, Il Kim, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Young Kun Jee, Kyung-Wook Paik:
Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 μm pitch Cu-pillar/Sn-Ag bump interconnection. Microelectron. Reliab. 55(2): 432-441 (2015)
2012
[j7]
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  - journals/mr/ChungKLSP12
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Chang-Kyu Chung, Jae-Han Kim, Jong-Won Lee, Kyoung-Won Seo, Kyung-Wook Paik:
Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high T_g ACFs in fine-pitch chip-on-glass applications. Microelectron. Reliab. 52(1): 217-224 (2012)
[j6]
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  - journals/mr/SukSCKLP12
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Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik:
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). Microelectron. Reliab. 52(1): 225-234 (2012)
[j5]
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Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik:
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages. Microelectron. Reliab. 52(6): 1174-1181 (2012)
[j4]
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Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim, Jong-Soo Kim, Kyung-Wook Paik:
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs). Microelectron. Reliab. 52(6): 1182-1188 (2012)

2000 – 2009

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2008
[j3]
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Kyung-Woon Jang, Chang-Kyu Chung, Woong-Sun Lee, Kyung-Wook Paik:
Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications. Microelectron. Reliab. 48(7): 1052-1061 (2008)
2006
[j2]
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  - journals/mr/YangJLP06
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Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik:
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. Microelectron. Reliab. 46(2-4): 512-522 (2006)
[j1]
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  - journals/mr/KwonHP06
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Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik:
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. Microelectron. Reliab. 46(2-4): 589-599 (2006)

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