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2020 – today
- 2020
[c11]Gwangmo Song, Yumee Kim, Kukjin Chun, Kyoung Mu Lee:
Multi Image Depth from Defocus Network with Boundary Cue for Dual Aperture Camera. ICASSP 2020: 2293-2297
2010 – 2019
- 2019
- [c10]Yumee Kim, Kukjin Chun:
Plano-Convex Lens Fabrication for Distance Sensor based on Single Vision. ICEIC 2019: 1-3 - [c9]Young Jae Kim, Kukjin Chun:
Novel Sperm Sorting Microfluidic Chip With Feedback Channel and Vertical Orientation. IEEE SENSORS 2019: 1-4 - [c8]Young Jae Kim, Kukjin Chun:
Lensless Imaging Sensor Kit for Sperm Counting with Microfluidic Chip. SAS 2019: 1-4 - 2018
- [c7]Chong Ho Hong, Kukjin Chun:
Tunable Aperture with Single layer Blades Actuated by Thermal Expansion of Silicon Beams. TENCON 2018: 579-582 - 2017
- [c6]Keewoong Haan, Kukjin Chun:
Tunable aperture controlled by thermal expansion of copper beams. AFRICON 2017: 1520-1521 - 2013
- [c5]Byeungleul Lee, Jinwoo Jeong, Chan-Seob Cho, Jinseok Kim, Bonghwan Kim, Hyeon Cheol Kim, Kukjin Chun:
Cantilever arrayed blood pressure sensor for arterial applanation tonometry. NEMS 2013: 907-910 - [c4]Jinwoo Jeong, Sehwan Kim, Jinseok Kim, Kukjin Chun:
Implantable CNT-based sensor for chondroitin sulfate proteoglycans detection of glial scar after spinal cord injury. NEMS 2013: 1190-1193 - 2011
- [j2]Kyoohyun Lim, Sunki Min, Sang-Hoon Lee, Jaewoo Park, Kisub Kang, Hwahyeong Shin, Hyunchul Shim, Sechang Oh, Sungho Kim, Jong-Ryul Lee, Changsik Yoo, Kukjin Chun:
A 2x2 MIMO Tri-Band Dual-Mode Direct-Conversion CMOS Transceiver for Worldwide WiMAX/WLAN Applications. IEEE J. Solid State Circuits 46(7): 1648-1658 (2011) - 2010
- [j1]Hyunjin Yoo, Donghyun Baek, Kukjin Chun, Yun Seong Eo:
A 2.3GHz linearized CMOS power amplifier with AM-AM and AM-PM distortion correction. IEICE Electron. Express 7(21): 1602-1607 (2010) - [c3]Kyoohyun Lim, Sunki Min, Sanghoon Lee, Jaewoo Park, Kisub Kang, Hwahyeong Shin, Hyunchul Shim, Sechang Oh, Sungho Kim, Jong-Ryul Lee, Changsik Yoo, Kukjin Chun:
A 2×2 MIMO tri-band dual-mode CMOS transceiver for worldwide WiMAX/WLAN applications. ESSCIRC 2010: 454-457
2000 – 2009
- 2006
- [c2]Jinseok Kim, Jungyul Park
, Suk-kyu Ryu, Jeongeun Baek, Sewan Park, Hyeon Cheol Kim, Kukjin Chun, Sukho Park:
Realistic computational modeling for hybrid biopolymer microcantilevers. EMBC 2006: 2102-2105 - [c1]Kyounghwan Na, Il-hwan Kim, Eunsung Lee, Hyeon Cheol Kim, Yong-Hwan Lee, Kukjin Chun:
Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist. ICMENS 2006: 31-34
Coauthor Index
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