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Cheng-Hsiu Yeh

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2008
[j1]
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Chi-Hui Chien, Thaiping Chen, Wei-Bang Lin, Chi-Chang Hsieh, Yii-Der Wu, Cheng-Hsiu Yeh:
Experimental and statistical study in adhesion features of bonded interfaces of IC packages. Microelectron. Reliab. 48(1): 140-148 (2008)

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