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ORCIDJun Wei 0003
Person information
- affiliation: Singapore Institute of Manufacturing Technology, Singapore
Other persons with the same name
- Jun Wei — disambiguation page
- Jun Wei 0001
![[0000-0002-8561-2481]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0002-8561-2481")
— Chinese Academy of Sciences, Institute of Software, State Key Laboratory of Computer Science, Beijing, China (and 1 more) - Jun Wei 0002 — Perception Vision Medical Technologies Co. Ltd., Guangzhou, China (and 2 more)
- Jun Wei 0004 — University of Naval Engineering, Department of Management, Wuhan, China
- Jun Wei 0005 — University of Jinan, School of Control Science and Engineering, Jinan, China
- Jun Wei 0006 — Shenzhen University, Visual Computing Research Center, Shenzhen, China (and 1 more)
- Jun Wei 0007 — Hebei University of Technology, School of Mechanical Engineering, Tianjin, China
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Journal Articles
- 2003
[j5]Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong:
Wafer Bonding Process Based On The Taguchi Analysis. Int. J. Comput. Eng. Sci. 4(2): 331-334 (2003)- [j4]Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang:
Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. Int. J. Comput. Eng. Sci. 4(2): 335-338 (2003) - [j3]Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong:
A Novel Wafer-Level Packaging Solution For Mems. Int. J. Comput. Eng. Sci. 4(2): 339-342 (2003) - [j2]W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai:
Influence Of Applied Load On Wafer Bonding In Vacuum. Int. J. Comput. Eng. Sci. 4(2): 351-354 (2003) - [j1]S. S. Deng, Jun Wei, Cher Ming Tan, M. L. Nai, W. B. Yu, H. Xie:
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. Int. J. Comput. Eng. Sci. 4(3): 655-658 (2003)
Coauthor Index
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