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David L. Questad

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2000 – 2009

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2008
[j2]
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  - journals/mr/ValdevitKSSQS08
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Lorenzo Valdevit, V. Khanna, Arun Sharma, Sri M. Sri-Jayantha, David L. Questad, K. Sikka:
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy. Microelectron. Reliab. 48(2): 245-260 (2008)
2005
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Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad:
Effects of mechanical stress and moisture on packaging interfaces. IBM J. Res. Dev. 49(4-5): 663-676 (2005)

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