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W. C. Tjiu

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2003
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T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu:
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectron. Reliab. 43(5): 803-809 (2003)

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