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P. Klofac

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2003
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P. Rajamand, Rainer Tilgner, Roland Schmidt, J. Baumann, P. Klofac, M. Rothenfusser:
Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures. Microelectron. Reliab. 43(9-11): 1815-1820 (2003)

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