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Kenichi Takeda
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2020 – today
- 2022
- [j3]Jim Bartels, Korkut Kaan Tokgoz, Sihan A, Masamoto Fukawa, Shohei Otsubo, Chao Li, Ikumi Rachi, Kenichi Takeda, Ludovico Minati, Hiroyuki Ito:
TinyCowNet: Memory- and Power-Minimized RNNs Implementable on Tiny Edge Devices for Lifelong Cow Behavior Distribution Estimation. IEEE Access 10: 32706-32727 (2022) - [j2]Chao Li, Korkut Kaan Tokgoz, Ayuka Okumura, Jim Bartels, Kazuhiro Toda, Hiroaki Matsushima, Takumi Ohashi, Kenichi Takeda, Hiroyuki Ito:
A Data Augmentation Method for Cow Behavior Estimation Systems Using 3-Axis Acceleration Data and Neural Network Technology. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 105-A(4): 655-663 (2022) - 2021
- [c5]Jim Bartels, Korkut Kaan Tokgoz, Masamoto Fukawa, Shohei Otsubo, Chao Li, Ikumi Rachi, Kenichi Takeda, Hiroyuki Ito:
A 216 μW, 87% Accurate Cow Behavior Classifying Decision Tree on FPGA with Interpolated Arctan2. ISCAS 2021: 1-5
2010 – 2019
- 2017
- [j1]Masashi Misawa, Shin-ei Kudo, Yuichi Mori, Kenichi Takeda, Yasuharu Maeda, Shinichi Kataoka, Hiroki Nakamura, Toyoki Kudo, Kunihiko Wakamura, Takemasa Hayashi, Atsushi Katagiri, Toshiyuki Baba, Fumio Ishida, Haruhiro Inoue, Yukitaka Nimura, Masahiro Oda, Kensaku Mori:
Accuracy of computer-aided diagnosis based on narrow-band imaging endocytoscopy for diagnosing colorectal lesions: comparison with experts. Int. J. Comput. Assist. Radiol. Surg. 12(5): 757-766 (2017) - 2013
- [c4]Yasuhiro Shinozuka, Hiroshi Fuketa, Koichi Ishida, Futoshi Furuta, Kenichi Osada, Kenichi Takeda, Makoto Takamiya, Takayasu Sakurai:
Reducing IR drop in 3D integration to less than 1/4 using Buck Converter on Top die (BCT) scheme. ISQED 2013: 210-215 - 2011
- [c3]Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda:
Void reduction in wafer bonding by simultaneously formed ventilation channels. 3DIC 2011: 1-5 - [c2]Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi:
Chip-level TSV integration for rapid prototyping of 3D system LSIs. 3DIC 2011: 1-4 - 2010
- [c1]Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda:
Wafer-level hybrid bonding technology with copper/polymer co-planarization. 3DIC 2010: 1-4
Coauthor Index
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