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Jian-Hong Jhang

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2012
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Te-yuan Chung, Jian-Hong Jhang, Jing-Sian Chen, Yi-Chien Lo, Gwo-Herng Ho, Mount-Learn Wu, Ching-Cherng Sun:
A study of large area die bonding materials and their corresponding mechanical and thermal properties. Microelectron. Reliab. 52(5): 872-877 (2012)

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