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Naim Lemar

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2024
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Sandeep Kumar Goel, Ankita Patidar, Moiz Khan, Frank Lee, Anshuman Chandra, Martin Keim, Naim Lemar, Jonathan Gaudet, Quoc Phan, Vidya Neerkundar:
Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard. ITC 2024: 451-459

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