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K. N. Subramanian

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Journal Articles

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2017
[j2]
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  - journals/mr/WuSBL17
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Yuelin Wu, K. N. Subramanian, Scott Calabrese Barton, Andre Lee:
Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages. Microelectron. Reliab. 78: 355-361 (2017)
2007
[j1]
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J. G. Lee, K. N. Subramanian:
Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints. Microelectron. Reliab. 47(1): 118-131 (2007)

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