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ORCIDDawei Wang 0016
Person information
- affiliation: Chinese Academy of Sciences, Shenzhen Institute of Advanced Technology, Shenzhen, China
Other persons with the same name
- Dawei Wang (aka: Da-Wei Wang) — disambiguation page
- Dawei Wang 0001
![[0000-0001-9981-3623]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0001-9981-3623")
— Northwestern Polytechnic University, Xi'an, China (and 1 more) - Dawei Wang 0002 — Chinese Academy of Sciences, Aerospace Information Research Institute, Beijing, China
- Dawei Wang 0003 (aka: Da-Wei Wang 0003) — Hangzhou Dianzi University, Hangzhou, China
- Dawei Wang 0004 (aka: Da-Wei Wang 0004) — Academia Sinica, Institute of Information Science, Taipei, Taiwan (and 1 more)
- Dawei Wang 0005 — National Computer Network Emergency Response Technical Team / Coordination Center of China, Beijing, China
- Dawei Wang 0006 — The University of Hong Kong, Pokfulam, Hong Kong
- Dawei Wang 0007 — Harbin Institute of Technology, Harbin, China
- Dawei Wang 0008 — University of Massachussets, Boston, MA, USA
- Dawei Wang 0009 — Institute of Scientific and Technical Information of China, Beijing, China
- Dawei Wang 0010 — Adaptive Spectrum and Signal Alignment Inc., Redwood City, CA, USA (and 1 more)
- Dawei Wang 0011 — Xi'an Jiaotong University, State Key Laboratory of Electrical Insulation for Power Equipment, Xi'an, China
- Dawei Wang 0012 — Sun Yat-sen University, Guangzhou, China
- Dawei Wang 0013 — Purdue University, West Lafayette, IN, USA
- Dawei Wang 0014 — RWTH Aachen University, Aachen, Germany
- Dawei Wang 0015 — Shandong University, Qilu Hospital, Jinan, China
- Dawei Wang 0017 — State Grid Shanxi Electric Power Research Institute, Taiyuan, China
- Dawei Wang 0018 — People's Public Security University of China, Beijing, China
- Dawei Wang 0019 — Shanxi Normal University, School of Physics and Information Engineering, Linfen, China
- Dawei Wang 0020 — National University of Defense Technology, Changsha, China
- Dawei Wang 0021 — Zhongguancun Laboratory, Beijing, China (and 1 more)
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2020 – today
- 2022
[j1]Shifeng Guo, Yangyang Huang, Dan Chen, Linlin Ren, Dawei Wang, Wei Feng:
In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution. IEEE Trans. Instrum. Meas. 71: 1-10 (2022)
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