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Y. Shimogaki

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2024
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T. Takagi, T. Ninomiya, M. Niwa, S. Obara, T. Momose, Y. Shimogaki, M. Nomura, H. Fujioka, M. Mori, T. Kuroda:
High Thermal Conductivity AlN Films for Advanced 3D Chiplets. VLSI Technology and Circuits 2024: 1-2

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