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Nahyun Rheem

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2024
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Nahyun Rheem, Jaeyong Jeong, Yoon-Je Suh, Chan Jik Lee, Bong Ho Kim, Joon Pyo Kim, Seong Kwang Kim, Hyeongrak Lim, Jongmin Kim, Dae-Hwan Ahn, Jae-Hoon Han, Jongwon Lee, Sanghyeon Kim:
First Heterogeneous and Monolithic 3D (HM3D) Integration of InGaAs HEMTs and InP/InGaAs DHBTs on Si CMOS for Next-Generation Wireless Communication. VLSI Technology and Circuits 2024: 1-2

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