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2020 – today
- 2024
[c4]S.-C. Chang, C. Neumann, B. Granados Alpizar, S. Atanasov, J. Peck, N. Kabir, Y.-C. Liao, S. Shivaraman, Wriddhi Chakraborty, N. Haratipour, I-Cheng Tung, V. Nikitin, G. Allen, T. Hoff, A. Oni, T. Tronic, A. Roy, H. Li, F. Hamzaoglu, M. Metz, I. Young, J. Kavalieros, U. Avci:
Reliable Low-Voltage FeRAM Capacitors for High-Speed Dense Embedded Memory in Advanced CMOS. VLSI Technology and Circuits 2024: 1-2- [c3]W. Mortelmans, P. Buragohain, C. Rogan, A. Kitamura, C. J. Dorow, K. P. O'Brien, R. Ramamurthy, J. Lux, T. Zhong, S. Harlson, E. Gillispie, T. Wilson, Adedapo Oni, A. Penumatcha, M. S. Kavrik, K. Maxey, A. Kozhakhmetov, C. C. Lin, S. Lee, A. Vyatskikh, N. Arefin, P. Fischer, J. Kevek, T. Tronic, M. Metz, S. B. Clendenning, U. Avci:
Record Performance in GAA 2D NMOS and PMOS Using Monolayer MoS2 and WSe2 with Scaled Contact and Gate Length. VLSI Technology and Circuits 2024: 1-2 - 2023
- [c2]C. H. Naylor, Kirby Maxey, C. Jezewski, K. P. O'Brien, A. V. Penumatcha, M. S. Kavrik, B. Agrawal, C. V. Littlefield, J. Lux, B. Barley, Justin R. Weber, A. Sen Gupta, C. J. Dorow, N. Arefin, S. King, R. Chebiam, J. Plombon, S. B. Clendenning, U. E. Avci, Mauro J. Kobrinsky, M. Metz:
2D Materials in the BEOL. VLSI Technology and Circuits 2023: 1-2 - 2022
- [c1]Kirby Maxey, C. H. Naylor, K. P. O'Brien, A. Penumatcha, Adedapo Oni, C. Mokhtarzadeh, C. J. Dorow, C. Rogan, B. Holybee, T. Tronic, D. Adams, N. Arefin, A. Sen Gupta, C.-C. Lin, T. Zhong, S. Lee, A. Kitamura, R. Bristol, S. B. Clendenning, U. Avci, M. Metz:
300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scaling. VLSI Technology and Circuits 2022: 419-420
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