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Daniel Meerovich

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2022
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Suresh Venkatesan, James Lee, Simon Chun Kiat Goh, Brian Pile, Daniel Meerovich, Jinyu Mo, Yang Jing, Lucas Soldano, Baochang Xu, Yu Zhang, Aaron Voon-Yew Thean, Yeow Kheng Lim:
A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer^TM. VLSI Technology and Circuits 2022: 381-382

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