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Himani Deshpande

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2020 – today

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2024
[c5]
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  - conf/chi/DeshpandeHMBZK24
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Himani Deshpande, Bo Han, Kongpyung (Justin) Moon, Andrea Bianchi, Clement Zheng, Jeeeun Kim:
Reconfigurable Interfaces by Shape Change and Embedded Magnets. CHI 2024: 325:1-325:12
[c4]
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Katherine W. Song, Fiona Bell, Himani Deshpande, Ilan Mandel, Tiffany Wun, Mirela Alistar, Leah Buechley, Wendy Ju, Jeeeun Kim, Eric Paulos, Samar Sabie, Ron Wakkary:
Sustainable Unmaking: Designing for Biodegradation, Decay, and Disassembly. CHI Extended Abstracts 2024: 489:1-489:7
2022
[c3]
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Himani Deshpande, Clement Zheng, Courtney Starrett, Jinsil Hwaryoung Seo, Jeeeun Kim:
Fab4D : An Accessible Hybrid Approach for Programmable Shaping and Shape Changing Artifacts. TEI 2022: 70:1-70:7
2021
[c2]
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Himani Deshpande, Haruki Takahashi, Jeeeun Kim:
EscapeLoom: Fabricating New Affordances for Hand Weaving. CHI 2021: 630:1-630:13
[c1]
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  - conf/scf/KwonDHDK21
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Nahyun Kwon, Himani Deshpande, Md. Kamrul Hasan, Aryabhat Darnal, Jeeeun Kim:
Multi-ttach: Techniques to Enhance Multi-material Attachments in Low-cost FDM 3D Printing. SCF 2021: 4:1-4:16

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