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2020 – today
- 2024
[j1]Efstathios Andrianopoulos
, Konstantinos Tokas, David de Felipe, Michael Theurer, Madeleine Weigel, Annachiara Pagano, Konstantina Kanta, Martin Kresse, Giorgos Megas, Christos Tsokos, Christos Kouloumentas, Anna Chiado Piat, Zerihun Tegegne, Maria Massaouti, Paraskevas Bakopoulos, Martin Moehrle, Patrick Runge, Norbert Keil, Panos Groumas, Hercules Avramopoulos:
Integrated 800 Gb/s O-band WDM optical transceiver enabled by hybrid InP-polymer photonic integration. J. Opt. Commun. Netw. 16(8): 44 (2024)- 2023
- [c23]Tobias Beckerwerth, Christoph Kottke, Volker Jungnickel, Ute Troppenz, Martin Möhrle, Patrick Runge, Martin Schell:
56 GBaud PAM-4 Direct Detection with High-Speed Avalanche Photodiodes. OFC 2023: 1-3 - [c22]Michael Theurer, Christoph Kottke, Ronald Freund, Felix Ganzer, Patrick Runge, Martin Moehrle, Ute Troppenz, Ariane Sigmund, Martin Schell:
4 x 200 Gb/s EML-Array with a Single MQW Layer Stack. OFC 2023: 1-4 - 2022
- [c21]Ute Troppenz, Michael Theurer, Martin Moehrle, Ariane Sigmund, Marko Gruner, Martin Schell:
Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays. OFC 2022: 1-3 - 2020
- [c20]Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Muhammad Rodlin Billah, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos:
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements. OFC 2020: 1-3 - [c19]M. Zander, W. Rehbein, Martin Moehrle, Steffen Breuer, D. Franke, Martin Schell, Kevin Kolpatzeck, Jan C. Balzer:
High Performance BH InAs/InP QD and InGaAsP/InP QW Mode-Locked Lasers as Comb and Pulse Sources. OFC 2020: 1-3
2010 – 2019
- 2019
- [c18]Moritz Baier, Francisco M. Soares, Axel Schoenau, Y. Durvasa Gupta, David Melzer, Martin Moehrle, Martin Schell:
Fully Integrated Stokes Vector Receiver for 400 Gbit/s. OFC 2019: 1-3 - 2018
- [c17]Moritz Baier, Francisco M. Soares, Tom Gaertner, A. Schoenau, Martin Möhrle, Martin Schell:
New Polarization Multiplexed Externally Modulated Laser PIC. ECOC 2018: 1-3 - [c16]David de Felipe, Martin Kresse, Hauke Conradi, Moritz Kleinert, M. Nuck, Crispin Zawadzki, A. Scheu, Walter Brinker, W. Rehbein, Ariane Sigmund, Martin Moehrle, Norbert Keil, Martin Schell:
Ultra-Wide Band Tunable Lasers on the PolyBoard Polymer-Waveguide Based Photonic Integration Platform. ECOC 2018: 1-3 - [c15]Francisco M. Soares, Moritz Baier, Tom Gaertner, Mike Feyer, Martin Moehrle, Norbert Grote, Martin Schell:
High-Performance InP PIC Technology Development based on a Generic Photonic Integration Foundry. OFC 2018: 1-3 - 2017
- [c14]Moritz Baier, Francisco M. Soares, Zhennan Zheng, Carsten Schmidt-Langhorst, Robert Elschner, Felix Frey, Marko Gruner, Johannes Karl Fischer, Colja Schubert, Martin Moehrle, Norbert Grote, Martin Schell:
112 Gb/s PDM-PAM4 Generation and 80 km Transmission Using a Novel Monolithically Integrated Dual-Polarization Electro-Absorption Modulator InP PIC. ECOC 2017: 1-3 - [c13]Muhammad Rodlin Billah, Juned N. Kemal, Pablo Marin-Palomo, Matthias Blaicher, Yasar Kutuvantavida, Clemens Kieninger, Heiner Zwickel, Philipp-Immanuel Dietrich, Stefan Wolf, Tobias Hoose, Yilin Xu, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos:
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators. ECOC 2017: 1-3 - [c12]Muhammad Rodlin Billah, Matthias Blaicher, Juned N. Kemal, Tobias Hoose, Heiner Zwickel, Philipp-Immanuel Dietrich, Ute Troppenz, Martin Möhrle, Florian Merget, A. Hofmann, Jeremy Witzens, Sebastian Randel, Wolfgang Freude, Christian Koos:
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding. OFC 2017: 1-3 - [c11]Jung Han Choi, Marko Gruner, Heinz-Gunter Bach, Michael Theurer, Ute Troppenz, Martin Möhrle, Martin Schell:
Ultra-low power SiGe driver-IC for high-speed electroabsorption modulated DFB lasers. OFC 2017: 1-3 - [c10]Michael Theurer, Martin Moehrle, Ute Troppenz, Heinz-Gunter Bach, Ariane Sigmund, Georges Przyrembel, Martin Schell:
4 × 56 Gb/s high output power electroabsorption modulated laser array. OFC 2017: 1-3 - 2016
- [c9]Tobias Hoose, Muhammad Rodlin Billah, Matthias Blaicher, Pablo Marin, Philipp-Immanuel Dietrich, Andreas Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, M. Thiel, P. Simon, Jörg Hoffmann, M. L. Goedecke, Wolfgang Freude, Christian Koos:
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. OFC 2016: 1-3 - [c8]Norbert Keil, David de Felipe, Ziyang Zhang, Moritz Kleinert, Crispin Zawadzki, Walter Brinker, Andrzej Polatynski, Gelani Irmscher, Martin Möhrle, Heinz-Gunter Bach, Martin Schell:
Novel integration technologies for disruptive capacity upgrade in data center systems. OFC 2016: 1-3 - [c7]Laurent Schares, Tam N. Huynh, M. G. Wood, Russell A. Budd, Fuad E. Doany, Daniel M. Kuchta, Nicolas Dupuis, Benjamin G. Lee, Clint L. Schow, Martin Moehrle, Ariane Sigmund, W. Rehbein, Tsung-Yang Liow, L. W. Luo, G. Q. Lo:
A gain-integrated silicon photonic carrier with SOA-array for scalable optical switch fabrics. OFC 2016: 1-3 - [c6]Michael Theurer, Yin Wang, Li Zeng, Ute Troppenz, Georges Przyrembel, Ariane Sigmund, Martin Moehrle, Martin Schell:
2 × 56 GB/s from a double side electroabsorption modulated DFB laser. OFC 2016: 1-3 - 2015
- [c5]Laurent Schares, Russell A. Budd, Daniel M. Kuchta, Fuad E. Doany, Clint Schow, Martin Möhrle, Ariane Sigmund, W. Rehbein:
Etched-facet semiconductor optical amplifiers for gain-integrated photonic switch fabrics. ECOC 2015: 1-3 - 2014
- [c4]Moritz Baier, R. Broeke, Francisco M. Soares, Marko Gruner, Angela Seeger, Martin Moehrle, Norbert Grote, Martin Schell:
100-Channel WDM Rx-type PIC on InP for use of low-cost and low power consumption electronics. ECOC 2014: 1-3 - [c3]Ziyang Zhang, David de Felipe, Walter Brinker, Moritz Kleinert, Alejandro Maese-Novo, Crispin Zawadzki, Martin Moehrle, Norbert Keil:
Bi-directional, crosstalk-suppressed, 40-nm wavelength tuneable colourless ONU on polymer platform. ECOC 2014: 1-3 - 2013
- [c2]Norbert Keil, Crispin Zawadzki, Ziyang Zhang, David de Felipe, Alejandro Maese-Novo, Walter Brinker, Holger Klein, Christoph Wagner, Francisco M. Soares, Martin Möhrle, Norbert Grote:
Progress in polymer-based components for next-generation PON applications. OFC/NFOEC 2013: 1-3 - [c1]Martin Schell, Heinz-Gunter Bach, Klemens Janiak, Norbert Keil, Martin Möhrle, Patrick Runge, Ziyang Zhang:
Coherent receiver photonic integrated circuits. OFC/NFOEC 2013: 1-3
Coauthor Index
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last updated on 2024-10-07 22:08 CEST by the dblp team
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