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Conference and Workshop Papers
- 2023
[c9]Lars Brusberg, Jürgen Matthies, Jason R. Grenier, Jeffrey S. Clark, Betsy J. Johnson, Chad C. Terwilliger:
Slim Push-Pull Fiber Array Connector for Optical Chips. OFC 2023: 1-3- 2022
- [c8]Lars Brusberg, Jason R. Grenier, Sükrü Ekin Kocabas, Aramais R. Zakharian, Lucas W. Yeary, Daniel W. Levesque, Barry J. Paddock, Robert A. Bellman, Robin M. Force, Chad C. Terwilliger, Clifford G. Sutton, Jeffrey S. Clark, Katerina Rousseva:
Glass Interposer for High-Density Photonic Packaging. OFC 2022: 1-3 - 2021
- [c7]Lars Brusberg, Jason R. Grenier, Jürgen Matthies, Allen M. Miller, Chad C. Terwilliger, Jeffrey S. Clark, Beibei Zeng, Pierre Beneke:
Passive Aligned Glass Waveguide Connector for Co-Packaged Optics. ECOC 2021: 1-4 - 2020
- [c6]Lars Brusberg, Aramais R. Zakharian, Sükrü Ekin Kocabas, Jason R. Grenier, Chad C. Terwilliger, Alan F. Evans:
Optoelectronic Glass Substrates for Co-Packaging of Optics and ASICs. OFC 2020: 1-3 - 2017
- [c5]Lars Brusberg, Michael DeJong, Margaret Allen, Ramsey Selim
, Douglas L. Butler, Jeffrey S. Clark, Clifford G. Sutton, Grahame Wood, Henk Bulthuis, Drew Lundsten, Jamie Stokes:
Fiber-to-Waveguide Connector for Co-Packaged Optics. ECOC 2017: 1-3 - 2015
- [c4]Lars Brusberg, Henning Schröder, Christian Herbst, Christopher Frey, Christian Fiebig, Aramais R. Zakharian, Sergey A. Kuchinsky, Xue Liu, Davide Fortusini, Alan F. Evans:
High performance ion-exchanged integrated waveguides in thin glass for board-level multimode optical interconnects. ECOC 2015: 1-3 - [c3]Andreas Håkansson, Tolga Tekin, Lars Brusberg, Nikos Pleros, Costas Vyrsokinos, Dimitris Apostolopoulos, Richard Pitwon, Allen M. Miller, Kai Wang, Domenico Tulli, Sander Dorrestein, Rutger Smink, Joek Tuin, Michiel van Rijnbach, Jeroen Duis:
PhoxTroT - a European initiative toward low cost and low power photonic interconnects for data centres. ICTON 2015: 1-5 - [c2]Lars Brusberg, Dionysios Manessis, Christian Herbst, Marcel Neitz, Beatrice Schild, Michael Topper, Henning Schröder, Tolga Tekin:
Single-mode board-level interconnects for silicon photonics. OFC 2015: 1-3 - 2014
- [c1]Lars Brusberg, Christian Herbst, Marcel Neitz, Henning Schröder, Klaus-Dieter Lang:
Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology. ECOC 2014: 1-3
Coauthor Index
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