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S. C. Hu

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Journal Articles

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2016
[j3]
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  - journals/mr/TsaiLCCWH16
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  - https://dblp.org/rec/journals/mr/TsaiLCCWH16
Ming-Yi Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu:
Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. Microelectron. Reliab. 67: 120-128 (2016)
2015
[j2]
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Ming-Yi Tsai, P. S. Huang, C. H. Lin, C. T. Wu, S. C. Hu:
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. Microelectron. Reliab. 55(12): 2589-2595 (2015)
1998
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Y. C. Chen, C. T. Chan, S. C. Hu:
Design and analysis of delay control for CBR services in ATM networks. Comput. Commun. 21(5): 445-459 (1998)

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