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Tobias Stuckenberg
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Journal Articles
- 2023
- [j3]Tobias Stuckenberg, Malte Rücker, Michel Gottschlich, Niklas Rother, Rochus Nowosielski, Frank Wiese, Holger Blume:
Design and Evaluation of a 180 nm Powerline Communication ASIC for Harsh Environment. Microprocess. Microsystems 97: 104742 (2023) - 2021
- [j2]Sven Gesper, Moritz Weißbrich, Tobias Stuckenberg, Pekka Jääskeläinen, Holger Blume, Guillermo Payá Vayá:
Evaluation of Different Processor Architecture Organizations for On-Site Electronics in Harsh Environments. Int. J. Parallel Program. 49(4): 541-569 (2021) - 2018
- [j1]Tobias Stuckenberg, Holger Blume:
A Hardware Efficient Preamble Detection Algorithm for Powerline Communication. J. Commun. 13(1): 1-7 (2018)
Conference and Workshop Papers
- 2023
- [c6]Gia Bao Thieu, Sven Gesper, Guillermo Payá Vayá, Christoph Riggers, Oliver Renke, Till Fiedler, Jakob Marten, Tobias Stuckenberg, Holger Blume, Christian Weis, Lukas Steiner, Chirag Sudarshan, Norbert Wehn, Lennart M. Reimann, Rainer Leupers, Michael Beyer, Daniel Köhler, Alisa Jauch, Jan Micha Borrmann, Setareh Jaberansari, Tim Berthold, Meinolf Blawat, Markus Kock, Gregor Schewior, Jens Benndorf, Frederik Kautz, Hans-Martin Blüthgen, Christian Sauer:
ZuSE Ki-Avf: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving. DATE 2023: 1-6 - [c5]Malte Hawich, Nico Rumpeltin, Malte Rücker, Tobias Stuckenberg, Holger Blume:
High Performance Instruction Fetch Structure within a RISC-V Processor for Use in Harsh Environments. SAMOS 2023: 255-268 - 2021
- [c4]Tobias Stuckenberg, Malte Rücker, Niklas Rother, Rochus Nowosielski, Frank Wiese, Holger Blume:
Powerline Communication System-on-Chip in 180 nm Harsh Environment SOI Technology. NorCAS 2021: 1-5 - 2020
- [c3]Anatolij Fandrich, Tobias Stuckenberg, Ira Diethelm:
DIY Smart Home: The Development of an Exemplary Internet of Things Infrastructure for Computer Science Education. ITiCSE 2020: 523-524 - 2019
- [c2]Sven Gesper, Moritz Weißbrich, Stephan Nolting, Tobias Stuckenberg, Pekka Jääskeläinen, Holger Blume, Guillermo Payá Vayá:
Evaluation of Different Processor Architecture Organizations for On-site Electronics in Harsh Environments. SAMOS 2019: 3-17 - [c1]Tobias Stuckenberg, Michel Gottschlich, Stephan Nolting, Holger Blume:
Design and Optimization of an ARM Cortex-M Based SoC for TCP/IP Communication in High Temperature Applications. SAMOS 2019: 169-183
Coauthor Index
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