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S. Reissaus

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2017
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Glenn Ross, Vesa Vuorinen, Michael Krause, S. Reissaus, Matthias Petzold, Mervi Paulasto-Kröckel:
XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. Microelectron. Reliab. 76-77: 390-394 (2017)

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