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S. Söhl

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Journal Articles

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2018
[j2]
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  - journals/mr/BrinckerKSEP18
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  - https://dblp.org/rec/journals/mr/BrinckerKSEP18
Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok:
Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. Microelectron. Reliab. 88-90: 774-778 (2018)
2017
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Mads Brincker, S. Söhl, R. Eisele, Vladimir N. Popok:
Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects. Microelectron. Reliab. 76-77: 378-382 (2017)

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