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Jong-Tae Moon

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2017
[j1]
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Hyungseok Yoon, Kwang-Seong Choi, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom, Insu Jeon:
Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. Microelectron. Reliab. 71: 41-50 (2017)

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